MediaTek Dimensity 7200 Ultra Chipset Launched with TSMC’s Second-gen 4nm

MediaTek Dimensity 7200 Ultra Chipset Launched with TSMC’s Second-gen 4nm

MediaTek has introduced its latest smartphone processor, the MediaTek Dimensity 7200 Ultra, in China. This octa-core processor is manufactured using the state-of-the-art 4nm process technology. The Dimensity 7200 Ultra chipset comes with an octa-core configuration. It also has a dedicated MediaTek APU for AI processing and has support for 5G connectivity. Furthermore, it has been officially announced that the Redmi Note 13 Pro+ will be the first smartphone to feature this new MediaTek processor, and its release is scheduled for later this month.

MediaTek Dimensity 7200 Ultra Chipset Review

The latest MediaTek Dimensity 7200 Ultra processor boasts an octa-core configuration and is built on an advanced 4nm architecture. This powerful chipset features a combination of 2 Cortex A715 cores and 6 Cortex 510 cores, complemented by a high-performance ARM Mali-G610 GPU.

The Dimensity 7200 Ultra is compatible with both LPDDR4x and LPDDR5 RAM types with a maximum frequency of 6400MHz.

The Dimensity 7200 Ultra supports cameras up to 200MP. Additionally, it is capable of recording 4K videos at 30 frames per second (fps). Furthermore, it can easily power Full HD+ displays with a remarkable 144Hz refresh rate.

The Dimensity 7200 Ultra comes with 5th generation MediaTek APU 650, which enhances its AI processing capabilities. Furthermore, it includes the Imagick 765 ISP, which is equipped to handle 14-bit HDR image processing.

The MediaTek Dimensity 7200 Ultra features 5G compatibility, offering support for dual 5G standby, VoNR (Voice over New Radio), and carrier aggregation.

MediaTek has announced that additional details about the processor will be revealed in the coming days. As of now, the chipset is not listed on MediaTek’s official website. It is possible that MediaTek may directly launch the details of this chipset in the Redmi Note 13 Series launch event, given the crucial partnership between MediaTek and Xiaomi.

MediaTek Dimensity 7200 Ultra Chipset Specifications

  • Architecture: 4nm.
  • Cores: octa-core, 2 x Cortex-A715 cores, 6 x Cortex-510 cores.
  • GPU: ARM Mali-G610.
  • Cameras: 200MP maximum, 4K 30fps video recording.
  • Connectivity: 5G, 4G LTE, WiFi 6E, Bluetooth 5.3, GPS.
  • Special Features: 5th-gen MediaTek APU 650, Imagiq 765 ISP.

The upcoming Redmi Note 13 series will be the first smartphone to feature the cutting-edge Dimensity 7200 Ultra processor. These devices have recently appeared on various certification websites, giving a glimpse of their specifications.

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